The Redmi K70 Pro was announced for the Chinese market a few hours ago, and earlier a local channel did a teardown of the device, revealing all its internals in all their glory.
This is undoubtedly the highest-end Redmi smartphone ever made, and it features the highest-end chipset from Qualcomm at the moment, a first for the brand, which is certainly fitting for the ten-year anniversary. Did we mention that Redmi turned ten this year? Well, he did. Anyway, if you don’t speak Chinese, don’t worry – English closed captions are available, just click the CC button in the player below.
The teardown reveals a lot of details about the phone’s components, including the camera sensors and all the different chipset makers on board. It’s a very informative and quick tour, which we recommend starting.
To recap, the Redmi K70 Pro features a 6.67-inch 1440×3200 120 Hz OLED screen with 4,000-nit peak brightness, Snapdragon 8 Gen 3 SoC, 12/16/24GB RAM, 256GB/512GB/1TB storage, triple rear camera system (50MP main with OIS, 12 MP ultrawide, 50 MP 2x optical zoom), a 16 MP selfie snapper, and a 5,000 mAh battery with support for 120W wired charging.